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This Week in Gaming (Week 9)

Welcome to the last week of February and this week we have a massive AAA release from a popular Capcom franchise that involves a lot of monsters in the wild. The rest of this week is a lot more low-key, with a rhythm platformer, a 2D scroller action ninja game, a co-op horror game, a retro collection which includes no less than 14 games and finally some greens and bunkers.

Monster Hunter Wilds / This week's AAA release / Friday 28 February
Fulfill your duty as a Hunter by tracking and defeating powerful monsters and forging strong new weapons and armor from the materials you harvest from your hunt as you uncover the connection between the people of the Forbidden Lands and the locales they inhabit. The ultimate hunting experience awaits you in Monster Hunter Wilds. Steam link Read full story


https://www.techpowerup.com/332988/this-...ing-week-9

GoDeal24 Unveils February Special Sale: Deep Discounts on Genuine Software

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https://www.techpowerup.com/332875/godea...e-software

(PR) COUGAR introduces the Airface ECO RGB ATX Mid-Tower Case

COUGAR, a global leader in PC cases, gaming furniture, peripherals, tech lifestyle and esports solutions, is excited to introduce the all-new Airface ECO RGB mid tower PC case with built-in eco-conscious cooling.

Sustainability is hardwired into the Airface ECO RGB's design ethos, ensuring cooling efficiency at reduced energy costs. At its heart is a forward-thinking venting system designed to maximize cooling while minimizing environmental impact. Its coned vents taper inward from a wide opening to funnel cooler air more efficiently. This innovative structure maintains lower internal temperatures, reducing the workload of powered cooling. Paired with dual 180 mm PWM fans, this design delivers exceptional airflow while keeping energy consumption to a minimum. Read full story


https://www.techpowerup.com/332818/couga...tower-case

(PR) Biostar to Showcase IPC Products at Embedded World 2025 Germany

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is set to showcase its latest industrial computing and edge AI computing solutions at upcoming Embedded World 2025. The event will take place from March 11-13, 2025, at Nurnberg Messe, Nurnberg, Germany, with BIOSTAR's booth located at 2-321, Hall 2.

At Embedded World 2025, BIOSTAR will spotlight its edge computing solutions powered by Intel CPUs, including AI-driven platforms tailored for industrial automation, smart cities, and HMI (Human-Machine Interface) applications. Key highlights will include 3.5" SBCs, NVIDIA Jetson Orin platforms, and industrial-grade systems engineered for scalable, efficient, and robust performance. Read full story


https://www.techpowerup.com/332761/biost...25-germany

(PR) FinalWire Releases AIDA64 v7.60 with Support for Next-Gen GPUs

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 7.60 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 7.60 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 7.60 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 7.60 software, a dedicated network audit toolset to collect and manage corporate network inventories. The latest AIDA64 update introduces green and purple dark themes, support for Turing LCD screens, and supports the latest graphics and GPGPU computing technologies by AMD, Intel and NVIDIA.

DOWNLOAD: FinalWire AIDA64 Extreme v7.60 Read full story


https://www.techpowerup.com/332702/final...t-gen-gpus

Intel Faces Potential Breakup as TSMC and Broadcom Explore Acquisition

According to sources close to the Wall Street Journal, Intel is weighing preliminary acquisition offers that could split the company into two parts: product and foundry. TSMC and Broadcom are independently exploring deals that would divide Intel's chip design and manufacturing operations. Broadcom has initiated informal discussions regarding Intel's chip design and marketing divisions, while TSMC is considering assembling an investor consortium to acquire Intel's facilities. This solution is improbable, as Intel's fabs are strategically one of the most critical aspects of the US semiconductor supply chain. Intel manufactures custom chips for the US Department of Defense; hence, having a foreign owner of fabs is not acceptable. The news about the acquisition comes as Intel grapples with manufacturing setbacks, including a total $13.4 billion loss in its foundry segment during 2024 and a significant erosion of market share in the AI processor market.

The acquisition talks face substantial regulatory hurdles, particularly regarding national security concerns. The US government has signaled resistance to foreign ownership of Intel's domestic manufacturing capabilities, which are deemed strategically vital to American technological sovereignty. This could particularly impact TSMC's bid for Intel's plants despite the Taiwanese company's position as the world's leading contract chipmaker. Intel's vulnerability to acquisition follows a series of strategic missteps under former leadership, including delayed manufacturing innovations and an increasing reliance on government subsidies for facility expansion. The company's share price has declined 60% from its 2021 highs amid these challenges, attracting potential buyers despite the complexity of any potential deal structure. Successful execution would require navigating both regulatory approval and the practical difficulties of disaggregating Intel's deeply integrated design and manufacturing operations.


https://www.techpowerup.com/332657/intel...cquisition

This Week in Gaming (Week 8)

Welcome to another week of new game releases and this week's AAA title takes place in the same world as Pillars of Eternity, for those that were a fan of that game from a decade ago. If RPG games aren't your cup of tea, how about a face full of Norwegian snow, or maybe the summer of 1995? How about some equestrian challenges, some pirate ninjas or maybe something a bit more dystopian? If so, we got the games for you this week.

Avowed / This week's AAA title / Tuesday 18 February
Avowed is a first-person fantasy RPG set in the world of Eora, where your choices carve a path through war, intrigue, and ancient mysteries. Navigate a land in turmoil, forge powerful alliances or deadly rivalries, and wield magic and steel to shape the fate of the Living Lands—and your own destiny. Steam link Read full story


https://www.techpowerup.com/332624/this-...ing-week-8

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AMD to Build Next-Gen I/O Dies on Samsung 4nm, Not TSMC N4P

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.


https://www.techpowerup.com/332533/amd-t...t-tsmc-n4p