
by TechMaster89 at 08-09-2024, 05:37 PM
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Design Issues May Postpone Launch of NVIDIA's Advanced Blackwell AI Chips
NVIDIA may face delays in releasing its newest artificial intelligence chips due to design issues, according to anonymous sources involved in chip and server hardware production cited by The Information. The delay could extend to three months or more, potentially affecting major customers such as Meta, Google, and Microsoft. An unnamed Microsoft employee and another source claim that NVIDIA has already informed Microsoft about delays affecting the most advanced models in the Blackwell AI chip series. As a result, significant shipments are not expected until the first quarter of 2025.
When approached for comment, an NVIDIA spokesperson did not address communications with customers regarding the delay but stated that "production is on track to ramp" later this year. The Information reports that Microsoft, Google, Amazon Web Services, and Meta declined to comment on the matter, while Taiwan Semiconductor Manufacturing Company (TSMC) did not respond to inquiries.Read full story
https://www.techpowerup.com/325190/desig...l-ai-chips
NVIDIA may face delays in releasing its newest artificial intelligence chips due to design issues, according to anonymous sources involved in chip and server hardware production cited by The Information. The delay could extend to three months or more, potentially affecting major customers such as Meta, Google, and Microsoft. An unnamed Microsoft employee and another source claim that NVIDIA has already informed Microsoft about delays affecting the most advanced models in the Blackwell AI chip series. As a result, significant shipments are not expected until the first quarter of 2025.
When approached for comment, an NVIDIA spokesperson did not address communications with customers regarding the delay but stated that "production is on track to ramp" later this year. The Information reports that Microsoft, Google, Amazon Web Services, and Meta declined to comment on the matter, while Taiwan Semiconductor Manufacturing Company (TSMC) did not respond to inquiries.Read full story
https://www.techpowerup.com/325190/desig...l-ai-chips

by TechMaster89 at 08-06-2024, 09:32 PM
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Intel Core Ultra 200V "Lunar Lake" CPUs Arrive on September 3rd
Intel has officially confirmed the upcoming Core Ultra 200V "Lunar Lake" CPU generation is arriving on September 3rd. The official media alert states: "Ahead of the IFA 2024 conference, join Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group, and Jim Johnson, senior vice president and general manager of the Client Business Group, and Intel partners as they launch the next generation of Intel Core Ultra processors, code-named Lunar Lake. During the livestreamed event, they will reveal details on the new processors' breakthrough x86 power efficiency, exceptional core performance, massive leaps in graphics performance and the unmatched AI computing power that will drive this and future generations of Intel products."
With IFA happening in Berlin from September 6th to 10th, Intel's Lunar Lake launch is also happening in Berlin just a few days before, on September 3rd at 6 p.m. CEST (9 a.m. PDT). We expect to see nine SKUs: Core Ultra 9 288V, Core Ultra 7 268V, Core Ultra 7 266V, Core Ultra 7 258V, Core Ultra 7 256V, Core Ultra 5 238V, Core Ultra 5 236V, Core Ultra 5 228V, and Core Ultra 5 226V. All of the aforementioned models feature four P-cores and four E-cores, with varying Xe2 GPU core counts and clocks. We also expect to see Intel present its design wins and upcoming Lunar Lake devices like laptops during the launch.
https://www.techpowerup.com/325079/intel...tember-3rd
Intel has officially confirmed the upcoming Core Ultra 200V "Lunar Lake" CPU generation is arriving on September 3rd. The official media alert states: "Ahead of the IFA 2024 conference, join Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group, and Jim Johnson, senior vice president and general manager of the Client Business Group, and Intel partners as they launch the next generation of Intel Core Ultra processors, code-named Lunar Lake. During the livestreamed event, they will reveal details on the new processors' breakthrough x86 power efficiency, exceptional core performance, massive leaps in graphics performance and the unmatched AI computing power that will drive this and future generations of Intel products."
With IFA happening in Berlin from September 6th to 10th, Intel's Lunar Lake launch is also happening in Berlin just a few days before, on September 3rd at 6 p.m. CEST (9 a.m. PDT). We expect to see nine SKUs: Core Ultra 9 288V, Core Ultra 7 268V, Core Ultra 7 266V, Core Ultra 7 258V, Core Ultra 7 256V, Core Ultra 5 238V, Core Ultra 5 236V, Core Ultra 5 228V, and Core Ultra 5 226V. All of the aforementioned models feature four P-cores and four E-cores, with varying Xe2 GPU core counts and clocks. We also expect to see Intel present its design wins and upcoming Lunar Lake devices like laptops during the launch.
https://www.techpowerup.com/325079/intel...tember-3rd

by TechMaster89 at 08-05-2024, 07:50 PM
0 comments
(PR) SK hynix Launches Its New GDDR7 Graphics Memory
SK hynix Inc. announced today that it introduced the industry's best-performing GDDR7, a next-generation graphics memory product. The development of GDDR7 in March comes amid growing interest by global customers in the AI space in the DRAM product that meets both specialized performance for graphics processing and fast speed. The company said that it will start volume production in the third quarter.
The new product comes with the operating speed of 32 Gbps, a 60% improvement from the previous generation and the speed can grow up to 40 Gbps depending on the circumstances. When adopted for the high-end graphics cards, the product can also process data of more than 1.5 TB per second, equivalent to 300 Full-HD movies (5 GB each), in a second. Read full story
https://www.techpowerup.com/325034/sk-hy...ics-memory
SK hynix Inc. announced today that it introduced the industry's best-performing GDDR7, a next-generation graphics memory product. The development of GDDR7 in March comes amid growing interest by global customers in the AI space in the DRAM product that meets both specialized performance for graphics processing and fast speed. The company said that it will start volume production in the third quarter.
The new product comes with the operating speed of 32 Gbps, a 60% improvement from the previous generation and the speed can grow up to 40 Gbps depending on the circumstances. When adopted for the high-end graphics cards, the product can also process data of more than 1.5 TB per second, equivalent to 300 Full-HD movies (5 GB each), in a second. Read full story
https://www.techpowerup.com/325034/sk-hy...ics-memory

by TechMaster89 at 08-04-2024, 02:45 PM
0 comments
AMD Zen 5 Recall Caused by a Typo?
AMD Ryzen 9000 series "Granite Ridge" desktop processors were supposed to start selling on July 31, 2024, but the launch has since been delayed. Since then, social media has been abuzz with theory crafting behind what could be the cause of the delay. AMD's announcement of the delay mentions: "During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations," causing some to speculate if there are design flaws such as the ones affecting Intel's 13th Gen and 14th Gen Core desktop processors. A picture doing rounds on social media has a more goofy explanation: there is a glaring typo on the product label printed on the integrated heatspreader (IHS) of the processors.
Apparently, some of the first batches of Ryzen 9000 processors see the brand extensions mislabeled. Ryzen 7 9700X is printed as "Ryzen 9 9700X." This error in the brand extension may have been easily "patched" if it was on the retail packaging (the box), where hardware manufacturers tend to fix typos by simply pasting stickers on them. You can't do this with the IHS, which is a key component of the processor's cooling mechanism. Also, since times immemorial, chip labels (information printed on the chip) have served as crucial last resorts for accuracy of information such as the chip's exact model number, steppings or revisions (if any), and production serial numbers, besides the chip's national origin, which determines the applicable import tariffs. A typo here could prove problematic. We're not entirely sure how AMD is fixing these errors with mere 1-2 week delays. It's likely that they're recalling the affected batch and simply replacing inventory in the channel with "good" batches. The recalled chips will simply have their IHS reprinted.
https://www.techpowerup.com/325011/amd-z...-by-a-typo
AMD Ryzen 9000 series "Granite Ridge" desktop processors were supposed to start selling on July 31, 2024, but the launch has since been delayed. Since then, social media has been abuzz with theory crafting behind what could be the cause of the delay. AMD's announcement of the delay mentions: "During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations," causing some to speculate if there are design flaws such as the ones affecting Intel's 13th Gen and 14th Gen Core desktop processors. A picture doing rounds on social media has a more goofy explanation: there is a glaring typo on the product label printed on the integrated heatspreader (IHS) of the processors.
Apparently, some of the first batches of Ryzen 9000 processors see the brand extensions mislabeled. Ryzen 7 9700X is printed as "Ryzen 9 9700X." This error in the brand extension may have been easily "patched" if it was on the retail packaging (the box), where hardware manufacturers tend to fix typos by simply pasting stickers on them. You can't do this with the IHS, which is a key component of the processor's cooling mechanism. Also, since times immemorial, chip labels (information printed on the chip) have served as crucial last resorts for accuracy of information such as the chip's exact model number, steppings or revisions (if any), and production serial numbers, besides the chip's national origin, which determines the applicable import tariffs. A typo here could prove problematic. We're not entirely sure how AMD is fixing these errors with mere 1-2 week delays. It's likely that they're recalling the affected batch and simply replacing inventory in the channel with "good" batches. The recalled chips will simply have their IHS reprinted.
https://www.techpowerup.com/325011/amd-z...-by-a-typo
Forum: PC Building

by TechMaster89 at 08-02-2024, 10:39 PM
0 comments
(PR) GIGABYTE Latest BIOS Update Preps AM5 Motherboard for Next-Gen AMD Ryzen 9000 s
GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.
GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's @BIOS, Q-Flash, or Q-Flash Plus technology. Read full story
https://www.techpowerup.com/324971/gigab...processors
GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.
GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's @BIOS, Q-Flash, or Q-Flash Plus technology. Read full story
https://www.techpowerup.com/324971/gigab...processors

by TechMaster89 at 08-01-2024, 01:13 PM
0 comments
Team Group Launches the T-Force GC PRO Gen 5 SSD
Team Group today introduced the T-Force GC PRO, its new performance-segment M.2 NVMe Gen 5 SSD. The new T-Force GC PRO is not to be confused with the T-Force GE PRO that Team Group launched in January 2024, although the two appear almost identical. The newer GC PRO is powered by the same InnoGrit "Tacoma" IG5666 controller as the GE PRO, but with slightly toned down speeds.
The GC PRO comes in 2 TB and 4 TB capacity variants, with maximum sequential speeds of 12,500 MB/s reads, with 11,000 MB/s writes. For comparison, the flagship GE PRO does 14,000 MB/s max sequential reads, albeit with the same 11,000 MB/s max sequential writes. The GC PRO is hence designed to stike a slightly lower price point which could see it square off against pre-Max14um Phison-powered SSD models. Both the 2 TB and 4 TB models offer identical sequential transfer speeds, but differ with endurance—1,200 TBW and 2,400 TBW, respectively. Although a heatsink is recommended by the manufacturer, the drive comes with a graphene-coated metal-foil heatspreader. The company didn't reveal pricing, the drives are backed by 5-year warranties.
https://www.techpowerup.com/324925/team-...-gen-5-ssd
Team Group today introduced the T-Force GC PRO, its new performance-segment M.2 NVMe Gen 5 SSD. The new T-Force GC PRO is not to be confused with the T-Force GE PRO that Team Group launched in January 2024, although the two appear almost identical. The newer GC PRO is powered by the same InnoGrit "Tacoma" IG5666 controller as the GE PRO, but with slightly toned down speeds.
The GC PRO comes in 2 TB and 4 TB capacity variants, with maximum sequential speeds of 12,500 MB/s reads, with 11,000 MB/s writes. For comparison, the flagship GE PRO does 14,000 MB/s max sequential reads, albeit with the same 11,000 MB/s max sequential writes. The GC PRO is hence designed to stike a slightly lower price point which could see it square off against pre-Max14um Phison-powered SSD models. Both the 2 TB and 4 TB models offer identical sequential transfer speeds, but differ with endurance—1,200 TBW and 2,400 TBW, respectively. Although a heatsink is recommended by the manufacturer, the drive comes with a graphene-coated metal-foil heatspreader. The company didn't reveal pricing, the drives are backed by 5-year warranties.
https://www.techpowerup.com/324925/team-...-gen-5-ssd

by TechMaster89 at 07-31-2024, 03:38 AM
16 comments
(PR) SK Hynix Announces 2Q24 Financial Results
SK hynix Inc. announced today that it recorded 16.4233 trillion won in revenues, 5.4685 trillion won in operating profit (with an operating margin of 33%), and 4.12 trillion won in net profit (with a net margin of 25%) in the second quarter. Quarter revenues marked all-time high, far exceeding the previous record of 13.811 trillion won in the second quarter of 2022. Operating profit also increased significantly, marking 5 trillion won for the first time in 6 years since the second quarter (5.5739 trillion won) and the third quarter (6.4724 trillion won) of 2018 during the semiconductor super boom.
The company said that continuous rise in overall prices of DRAM and NAND products with strong demand for AI memories including HBM led to 32% increase in revenues compared to the previous quarter. Also, with the sales for premium products on the rise and exchange rate effects adding, the operating profit ratio in the second quarter rose 10 percentage points from the previous quarter to 33%, performing to market expectations. Read full story
https://www.techpowerup.com/324890/sk-hy...al-results
SK hynix Inc. announced today that it recorded 16.4233 trillion won in revenues, 5.4685 trillion won in operating profit (with an operating margin of 33%), and 4.12 trillion won in net profit (with a net margin of 25%) in the second quarter. Quarter revenues marked all-time high, far exceeding the previous record of 13.811 trillion won in the second quarter of 2022. Operating profit also increased significantly, marking 5 trillion won for the first time in 6 years since the second quarter (5.5739 trillion won) and the third quarter (6.4724 trillion won) of 2018 during the semiconductor super boom.
The company said that continuous rise in overall prices of DRAM and NAND products with strong demand for AI memories including HBM led to 32% increase in revenues compared to the previous quarter. Also, with the sales for premium products on the rise and exchange rate effects adding, the operating profit ratio in the second quarter rose 10 percentage points from the previous quarter to 33%, performing to market expectations. Read full story
https://www.techpowerup.com/324890/sk-hy...al-results
Forum: PC Building

by TechMaster89 at 07-30-2024, 01:00 AM
0 comments
CPU-Z Screenshot of Alleged Intel Core Ultra 9 285K "Arrow Lake" ES Surfaces, Confir
A CPU-Z screenshot of an alleged Intel Core Ultra 9 285K "Arrow Lake-S" desktop processor engineering sample is doing rounds on social media, thanks to wxnod. CPU-Z identifies the chip with an Intel Core Ultra case badge with the deep shade of blue associated with the Core Ultra 9 brand extension, which hints at this being the top Core Ultra 9 285K processor model, we know it's the "K" or "KF" SKU looking at its processor base power reading of 125 W. The chip is built in the upcoming Intel Socket LGA1851. CPU-Z displays the process node as 7 nm, which corresponds with the Intel 4 foundry node.
Intel is using the same Intel 4 foundry node for "Arrow Lake-S" as the compute tile of its "Meteor Lake" processor. Intel 4 offers power efficiency and performance comparable to 4 nm nodes from TSMC, although it is physically a 7 nm node. Likewise, the Intel 3 node is physically 5 nm. If you recall, the main logic tile of "Lunar Lake" is being built on the TSMC N3P (3 nm) node. This means that Intel is really gunning for performance/Watt with "Lunar Lake," to get as close to the Apple M3 Pro as possible. Read full story
https://www.techpowerup.com/324863/cpu-z...-4-process
A CPU-Z screenshot of an alleged Intel Core Ultra 9 285K "Arrow Lake-S" desktop processor engineering sample is doing rounds on social media, thanks to wxnod. CPU-Z identifies the chip with an Intel Core Ultra case badge with the deep shade of blue associated with the Core Ultra 9 brand extension, which hints at this being the top Core Ultra 9 285K processor model, we know it's the "K" or "KF" SKU looking at its processor base power reading of 125 W. The chip is built in the upcoming Intel Socket LGA1851. CPU-Z displays the process node as 7 nm, which corresponds with the Intel 4 foundry node.
Intel is using the same Intel 4 foundry node for "Arrow Lake-S" as the compute tile of its "Meteor Lake" processor. Intel 4 offers power efficiency and performance comparable to 4 nm nodes from TSMC, although it is physically a 7 nm node. Likewise, the Intel 3 node is physically 5 nm. If you recall, the main logic tile of "Lunar Lake" is being built on the TSMC N3P (3 nm) node. This means that Intel is really gunning for performance/Watt with "Lunar Lake," to get as close to the Apple M3 Pro as possible. Read full story
https://www.techpowerup.com/324863/cpu-z...-4-process

by TechMaster89 at 07-28-2024, 02:07 PM
0 comments
Several AMD RDNA 4 Architecture Ray Tracing Hardware Features Leaked
We've known since May that AMD is giving its next generation RDNA 4 graphics architecture a significant upgrade with ray tracing performance, and had some clue since then, that the company is working on putting more of the ray tracing workflow through dedicated, fixed function hardware, unburdening the shader engine further. Kepler_L2, a reliable source with GPU leaks sheds light on some of the many new hardware features AMD is introducing with RDNA 4 to better accelerate ray tracing, which should give its GPUs a reduced performance cost of having ray tracing enabled. Kepler_L2 believes that these hardware features should also make it to the GPU of the upcoming Sony PlayStation 5 Pro.
To begin with, the RDNA 4 ray accelerator introduces the new Double Ray Tracing Intersect Engine, which should at least mean a 100% ray intersection performance increase over RDNA 3, which in turn offered a 50% increase over that of RDNA 2. The new RT instance node transform instruction should improve the way the ray accelerators handle geometry. Some of the other features we have trouble describing include a 64-byte RT node, ray tracing tri-pair optimization, Change flags encoded in barycentrics to simplify detection of procedural nodes; improved BVH footprint (possibly memory footprint): and RT support for oriented bounding box and instance node intersection. AMD is expected to debut Radeon RX series gaming GPUs based on RDNA 4 in early 2025.
https://www.techpowerup.com/324767/sever...res-leaked
We've known since May that AMD is giving its next generation RDNA 4 graphics architecture a significant upgrade with ray tracing performance, and had some clue since then, that the company is working on putting more of the ray tracing workflow through dedicated, fixed function hardware, unburdening the shader engine further. Kepler_L2, a reliable source with GPU leaks sheds light on some of the many new hardware features AMD is introducing with RDNA 4 to better accelerate ray tracing, which should give its GPUs a reduced performance cost of having ray tracing enabled. Kepler_L2 believes that these hardware features should also make it to the GPU of the upcoming Sony PlayStation 5 Pro.
To begin with, the RDNA 4 ray accelerator introduces the new Double Ray Tracing Intersect Engine, which should at least mean a 100% ray intersection performance increase over RDNA 3, which in turn offered a 50% increase over that of RDNA 2. The new RT instance node transform instruction should improve the way the ray accelerators handle geometry. Some of the other features we have trouble describing include a 64-byte RT node, ray tracing tri-pair optimization, Change flags encoded in barycentrics to simplify detection of procedural nodes; improved BVH footprint (possibly memory footprint): and RT support for oriented bounding box and instance node intersection. AMD is expected to debut Radeon RX series gaming GPUs based on RDNA 4 in early 2025.
https://www.techpowerup.com/324767/sever...res-leaked

by TechMaster89 at 07-27-2024, 11:08 AM
0 comments
Intel Intros 14th Gen Core "E" Embedded Processors with E-cores Disabled
Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.
Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base. Read full story
https://www.techpowerup.com/324733/intel...s-disabled
Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.
Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base. Read full story
https://www.techpowerup.com/324733/intel...s-disabled
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